Integrated circuit packaging is the final process in the manufacture of semiconductor devices. In this process, a small portion of the material used to manufacture the semiconductor device is wrapped in a supplemental case. This is mainly done to avoid not only physical damage, but also corrosive activity, which can negatively affect the semiconductor device. A supplemental case, also called a package, is used to provide a medium for electrical contact. These electrical contacts form a bridge between the semiconductor device and each circuit board.
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The Report includes Several Company Profiles of who are market key players
For competitor segment, the report includes global key players of Pressed Ceramic Packages as well as some small players. At least 8 companies are included:
* Teledyne Microelectronics (US)
* SCHOTT AG (Germany)
* AMETEK (US)
* Amkor Technology (US)
* Texas Instruments (US)
* Micross Components (US)
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For product type segment, this report listed main product type of Pressed Ceramic Packages market
* Ceramic-metal sealing (CERTM)
* Glass-metal sealing (GTMS)
* Passivation glass
* Transponder glass
* Reed glass
Ceramic IC packages, as the name suggests, are manufactured from ceramic materials. Depending on material type, quality, and other factors, a plethora of IC packages can be made using ceramic. These packages can provide a completely sealed environment, so that the packed devices are not affected by being in contact with air, thus avoiding negative corrosion effects. The package can also be manufactured in small sizes, even if they are required to provide numerous electrical connections.
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The study objectives are:
To analyze and research the global Pressed Ceramic Packages status and future forecast, involving capacity, production, value, consumption, growth rate (CAGR), market share, historical and forecast.
To present the key Pressed Ceramic Packages manufacturers, capacity, production, revenue, market share, and recent development for key players.
To split the breakdown data by regions, type, companies and applications.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
In this study, the years considered to estimate the market size of Pressed Ceramic Packages are as follows:
History Year: 2014-2019
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
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